JPS624341Y2 - - Google Patents
Info
- Publication number
- JPS624341Y2 JPS624341Y2 JP10663083U JP10663083U JPS624341Y2 JP S624341 Y2 JPS624341 Y2 JP S624341Y2 JP 10663083 U JP10663083 U JP 10663083U JP 10663083 U JP10663083 U JP 10663083U JP S624341 Y2 JPS624341 Y2 JP S624341Y2
- Authority
- JP
- Japan
- Prior art keywords
- lift frame
- lift
- spring
- bolster
- springs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
Landscapes
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10663083U JPS5985627U (ja) | 1983-07-08 | 1983-07-08 | プレス機械のダイリフタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10663083U JPS5985627U (ja) | 1983-07-08 | 1983-07-08 | プレス機械のダイリフタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5985627U JPS5985627U (ja) | 1984-06-09 |
| JPS624341Y2 true JPS624341Y2 (en]) | 1987-01-31 |
Family
ID=30249456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10663083U Granted JPS5985627U (ja) | 1983-07-08 | 1983-07-08 | プレス機械のダイリフタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5985627U (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7566635B2 (en) | 2002-03-12 | 2009-07-28 | Hamamatsu Photonics K.K. | Substrate dividing method |
| US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
| US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
-
1983
- 1983-07-08 JP JP10663083U patent/JPS5985627U/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
| US8933369B2 (en) | 2000-09-13 | 2015-01-13 | Hamamatsu Photonics K.K. | Method of cutting a substrate and method of manufacturing a semiconductor device |
| US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
| US8969761B2 (en) | 2000-09-13 | 2015-03-03 | Hamamatsu Photonics K.K. | Method of cutting a wafer-like object and semiconductor chip |
| US7566635B2 (en) | 2002-03-12 | 2009-07-28 | Hamamatsu Photonics K.K. | Substrate dividing method |
| US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5985627U (ja) | 1984-06-09 |
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